Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement

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Synopsis
As demand for on-chip functionalities and requirements for low power operation continue to increase as a result of the emergence in mobile, wearable and internet-of-things (IoT) products, 3D/2.5D have been identified as an inevitable path moving forward. As circuits become more and more complex, especially three-dimensional ones, new insights have to be developed in many domains, including electrical, thermal, noise, interconnects, and parasites. It is the entanglement of such domains that begins the very key challenge as we enter in 3D nano-electronics. This book aims to develop this new paradigm, going to a synthesis beginning between many technical aspects.
Copyright:
2019

Book Details

Book Quality:
Publisher Quality
Book Size:
226 Pages
ISBN-13:
9780429680069
Related ISBNs:
9780429399619, 9780367023430
Publisher:
CRC Press
Date of Addition:
Copyrighted By:
Taylor & Francis Group, LLC
Adult content:
No
Language:
English
Has Image Descriptions:
No
Categories:
Nonfiction, Computers and Internet, Technology
Submitted By:
Bookshare Staff
Usage Restrictions:
This is a copyrighted book.

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