3D Microelectronic Packaging: From Architectures to Applications (2nd ed. 2021) (Springer Series in Advanced Microelectronics #64)
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- Synopsis
- This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. It provides readers an in-depth understanding of the latest research and development findings regarding this key industry trend, including TSV, die processing, micro-bumps for LMI and MMI, direct bonding and advanced materials, as well as quality, reliability, fault isolation, and failure analysis for 3D microelectronic packages. Images, tables, and didactic schematics are used to illustrate and elaborate on the concepts discussed. Readers will gain a general grasp of 3D packaging, quality and reliability concerns, and common causes of failure, and will be introduced to developing areas and remaining gaps in 3D packaging that can help inspire future research and development.
- Copyright:
- 2021
Book Details
- Book Quality:
- Publisher Quality
- ISBN-13:
- 9789811570902
- Related ISBNs:
- 9789811570896
- Publisher:
- Springer Singapore, Singapore
- Date of Addition:
- 12/29/20
- Copyrighted By:
- Springer
- Adult content:
- No
- Language:
- English
- Has Image Descriptions:
- No
- Categories:
- Nonfiction, Science, Technology
- Submitted By:
- Bookshare Staff
- Usage Restrictions:
- This is a copyrighted book.
- Edited by:
- Yan Li
- Edited by:
- Deepak Goyal