Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments (Resilience and Sustainability in Civil, Mechanical, Aerospace and Manufacturing Engineering Systems)

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Copyright:
2022

Book Details

Book Quality:
Publisher Quality
Book Size:
290 Pages
ISBN-13:
9781000511086
Related ISBNs:
9781032160856, 9781003247005, 9781032160818
Publisher:
CRC Press
Date of Addition:
Copyrighted By:
Juan Cepeda-Rizo, Jeremiah Gayle, and Joshua Ravich, CRC Press is an imprint of Taylor & Francis Group, LLC Reasonable efforts have been made to publish reliable data and information, but the author and publisher cannot assume responsibility for the validi
Adult content:
No
Language:
English
Has Image Descriptions:
No
Categories:
Nonfiction, Technology
Submitted By:
Bookshare Staff
Usage Restrictions:
This is a copyrighted book.

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