Semiconductor Packaging: Materials Interaction and Reliability
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- Synopsis
- In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.
- Copyright:
- 2012
Book Details
- Book Quality:
- Publisher Quality
- Book Size:
- 216 Pages
- ISBN-13:
- 9781000218619
- Related ISBNs:
- 9781439862056, 9780429063350, 9781138075405
- Publisher:
- CRC Press
- Date of Addition:
- 09/09/23
- Copyrighted By:
- Taylor
- Adult content:
- No
- Language:
- English
- Has Image Descriptions:
- No
- Categories:
- Nonfiction, Technology
- Submitted By:
- Bookshare Staff
- Usage Restrictions:
- This is a copyrighted book.