Wafer Level 3-D ICs Process Technology
By: and and
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- Synopsis
- This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology. They are from academia, research labs and industry.
- Copyright:
- 2009
Book Details
- Book Quality:
- Publisher Quality
- ISBN-13:
- 9780387765341
- Related ISBNs:
- 9780387765327
- Publisher:
- Springer US
- Date of Addition:
- 05/01/13
- Copyrighted By:
- Springer US, Boston, MA
- Adult content:
- No
- Language:
- English
- Has Image Descriptions:
- No
- Categories:
- Nonfiction, Technology
- Submitted By:
- Bookshare Staff
- Usage Restrictions:
- This is a copyrighted book.
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