Moisture Sensitivity of Plastic Packages of IC Devices

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Synopsis
Moisture Sensitivity of Plastic Packages of IC Devices provides information on the state-of-the-art techniques and methodologies related to moisture issues in plastic packages. The most updated, in-depth and systematic technical and theoretical approaches are addressed in the book. Numerous industrial applications are provided, along with the results of the most recent research and development efforts, including, but not limited to: thorough exploration of moisture's effects based on lectures and tutorials by the authors, consistent focus on solution-based approaches and methodologies for improved reliability in plastic packaging, emerging theories and cutting-edge industiral applications presented by the leading professionals in the field.

Moisture plays a key role in the reliability of plastic packages of IC devices, and moisture-induced failures have become an increasing concern with the development of advanced IC devices. This second volume in the Micro- and Opto-Electronic Materials, Structures, and Systems series is a must-read for researchers and engineers alike.

Advisory: It has been reported to us that this book contains equations, tables, and graphs that have been rendered by the publisher as images without image descriptions.

Copyright:
2010

Book Details

Book Quality:
Publisher Quality
ISBN-13:
9781441957191
Related ISBNs:
9781441957184
Publisher:
Springer US
Date of Addition:
Copyrighted By:
Springer
Adult content:
No
Language:
English
Has Image Descriptions:
No
Categories:
Nonfiction, Technology
Submitted By:
Bookshare Staff
Usage Restrictions:
This is a copyrighted book.

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