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3D-Druck und allgegenwärtige Fertigung
by Tin-Chih Toly ChenDieses Buch bietet einen umfassenden Überblick über die Anwendungen von 3D-Drucktechnologien in der allgegenwärtigen Fertigung (Ubiquitous Manufacturing, UM). UM selbst stellt eine Anwendung des Ubiquitären Computings im Fertigungssektor dar, und dieses Buch zeigt, wie es bequemen, bedarfsgerechten Netzwerkzugang zu einem gemeinsamen Pool konfigurierbarer Fertigungsressourcen, einschließlich Software-Tools, Ausrüstung und Fähigkeiten, bietet. Aufgrund seines Umfangs wird das Buch für Forscher in den Bereichen Fertigung, Maschinenbau, Betriebsmanagement, Produktionssteuerung, Ubiquitäres Computing und Sensortechnologien sowie für praktizierende Manager und Ingenieure von großem Interesse sein.
3D-Drucken: Wie die generative Fertigungstechnik funktioniert (Technik im Fokus)
by Petra FastermannDas 3D-Drucken entwickelt sich rasant. L#65533;ngst ist der 3D-Druck f#65533;r Interessierte eine Fertigungs-Technologie, die sie selbst nutzen m#65533;chten. Doch welche M#65533;glichkeiten bietet 3D-Druck? Welche neuen Entwicklungen gibt es? Wie hat sich 3D-Druck etabliert? Was ist in den letzten Jahren selbstverst#65533;ndlich geworden? Was ist verbessert worden? Mit der zweiten, #65533;berarbeiteten und aktualisierten Auflage beantwortet die Autorin diese Fragen. Die 3D-Druck-Technologie wird - auch f#65533;r Nicht-Techniker - verst#65533;ndlich erkl#65533;rt. Hinweise auf kostenlose 3D-CAD-Software-Programme und weiterf#65533;hrende Literatur laden dazu ein, das Gelesene zu vertiefen und selbst anzuwenden.
3D-Drucken: Wie die generative Fertigungstechnik funktioniert (Technik im Fokus)
by Petra FastermannWie funktioniert 3D-Druck? Wofür eignet sich welche 3D-Druck-Technologie? Was bedeutet 3D-Druck für den Einzelnen? Welche gesellschaftlichen und wirtschaftlichen Veränderungen wird es durch diese Zukunftstechnologie geben? Die Autorin gibt Antworten auf diese Fragen. Sie führt präzise und einfach in die immer populärer werdende Technologie des 3D-Drucks ein. Die Leser werden so in den Stand versetzt, 3D-Druck selbst anzuwenden. Sie lernen, kostenlose Software auszuprobieren oder vielleicht sogar in einer der immer zahlreicher werdenden offenen Werkstätten (FabLabs) einen 3D-Drucker selbst zu nutzen.
3D Engine Design for Virtual Globes
by Patrick Cozzi Kevin RingSupported with code examples and the authors’ real-world experience, this book offers the first guide to engine design and rendering algorithms for virtual globe applications like Google Earth and NASA World Wind. The content is also useful for general graphics and games, especially planet and massive-world engines. With pragmatic advice throughout, it is essential reading for practitioners, researchers, and hobbyists in these areas, and can be used as a text for a special topics course in computer graphics. Topics covered include: Rendering globes, planet-sized terrain, and vector data; Multithread resource management; Out-of-core algorithms; Shader-based renderer design.
3D Engine Design for Virtual Globes
by Patrick Cozzi Kevin RingSupported with code examples and the authors' real-world experience, this book offers the first guide to engine design and rendering algorithms for virtual globe applications like Google Earth and NASA World Wind. The content is also useful for general graphics and games, especially planet and massive-world engines. With pragmatic advice throughout
3D Face Modeling, Analysis and Recognition
by Remco Veltkamp Anuj Srivastava Mohamed Daoudi3D Face Modeling, Analysis and Recognition presents methodologies for analyzing shapes of facial surfaces, develops computational tools for analyzing 3D face data, and illustrates them using state-of-the-art applications. The methodologies chosen are based on efficient representations, metrics, comparisons, and classifications of features that are especially relevant in the context of 3D measurements of human faces. These frameworks have a long-term utility in face analysis, taking into account the anticipated improvements in data collection, data storage, processing speeds, and application scenarios expected as the discipline develops further.The book covers face acquisition through 3D scanners and 3D face pre-processing, before examining the three main approaches for 3D facial surface analysis and recognition: facial curves; facial surface features; and 3D morphable models. Whilst the focus of these chapters is fundamentals and methodologies, the algorithms provided are tested on facial biometric data, thereby continually showing how the methods can be applied.Key features:* Explores the underlying mathematics and will apply these mathematical techniques to 3D face analysis and recognition* Provides coverage of a wide range of applications including biometrics, forensic applications, facial expression analysis, and model fitting to 2D images* Contains numerous exercises and algorithms throughout the book
3D FEA Simulations in Machining (SpringerBriefs in Applied Sciences and Technology)
by Panagiotis Kyratsis Anastasios Tzotzis J. Paulo DavimThis book covers machining simulations using advanced nonlinear finite element analysis (FEA) methodologies coupled with CAD-based techniques. The content increases awareness about the possibilities to reduce the actual experimental work via experimentally validated simulations using nonlinear finite element analysis.
3D Geoinformation Science: The Selected Papers of the 3D GeoInfo 2014 (Lecture Notes in Geoinformation and Cartography #94)
by Martin Breunig Mulhim Al-Doori Edgar Butwilowski Paul V. Kuper Joachim Benner Karl Heinz HaefeleNowadays 3D Geoinformation is needed for many planning and analysis tasks. For example, 3D city and infrastructure models are paving the way for complex environmental and noise analyzes. 3D geological sub-surface models are needed for reservoir exploration in the oil-, gas-, and geothermal industry. Thus 3D Geoinformation brings together researchers and practitioners from different fields such as the geo-sciences, civil engineering, 3D city modeling, 3D geological and geophysical modeling, and, last but not least, computer science. The diverse challenges of 3D Geoinformation Science concern new approaches and the development of standards for above- and under-ground 3D modeling, efficient 3D data management, visualization and analysis. Finally, the integration of different 3D approaches and data models is seen as one of the most important challenges to be solved.
3D Graphene: Fundamentals, Synthesis, and Emerging Applications (Carbon Nanostructures)
by Ram K. GuptaThis book provides a comprehensive overview of the synthesis, properties, and emerging applications of 3D graphene. It begins with an introduction to 3D graphene and covers the methods for synthesizing and printing 3D graphene. The book explores the characteristics of 3D graphene, including its morphology, surface area, and porosity, and the techniques used for characterizing it. Architectural and chemical aspects of 3D graphene for emerging applications are discussed, including energy storage, environmental remediation, and biosensing. The book reviews recent advancements in 3D graphene for electrochemical sensors, biosensors, and optical sensors, as well as its use in flexible sensors. It also covers the use of graphene-based materials for the remediation of hydrogen sulfide gas and the removal of inorganic pollutants and pharmaceutical residues. The book further explores the use of 3D graphene in metal-ion and metal-air batteries, flexible and wearable batteries, and high-performance supercapacitors. It also covers its use in photovoltaics, fuel cells, and as electrocatalysts and photocatalysts for water splitting. Additionally, the book discusses the use of 3D graphene in flexible electronics, capacitive de-ionization of water, and theranostic applications. Finally, the book addresses the toxicity, stability, recycling, and risk assessments of 3D graphene, providing a comprehensive understanding of the material's safety and sustainability considerations. Overall, this book is a valuable resource for researchers, engineers, and students interested in the synthesis, properties, and applications of 3D graphene.
3D IC and RF SiPs: Advanced Stacking And Planar Solutions For 5g Mobility (Wiley - IEEE)
by Lih-Tyng Hwang Tzyy-Sheng Jason HorngAn interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessments Features an interdisciplinary approach to the enabling technologies and hardware for 3D ICs and 5G mobility Presents statistical treatments and examples with tools that are easily accessible, such as Microsoft’s Excel and Minitab Fundamental design topics such as electromagnetic design for logic and RF/passives centric circuits are explained in detail Provides chapter-wise review questions and powerpoint slides as teaching tools
3D Imaging of the Environment: Mapping and Monitoring
by John MeneelyThis is a comprehensive, overarching, interdisciplinary book and a valuable contribution to a unified view of visualisation, imaging, and mapping. It covers a variety of modern techniques, across an array of spatial scales, with examples of how to map, monitor, and visualise the world in which we live. The authors give detailed explanations of the techniques used to map and monitor the built and natural environment and how that data, collected from a wide range of scales and cost options, is translated into an image or visual experience. It is written in a way that successfully reaches technical, professional, and academic readers alike, particularly geographers, architects, geologists, and planners. FEATURES Includes in-depth discussion on 3D image processing and modeling Focuses on the 3D application of remote sensing, including LiDAR and digital photography acquired by UAS and terrestrial techniques Introduces a broad range of data collection techniques and visualisation methods Includes contributions from outstanding experts and interdisciplinary teams involved in earth sciences Presents an open access chapter about the EU-funded CHERISH Project, detailing the development of a toolkit for the 3D documentation and analysis of the combined coastline shared between Ireland and Wales Intended for those with a background in the technology involved with imaging and mapping, the contributions shared in this book introduce readers to new and emerging 3D imaging tools and programs.
3D Imaging Technologies—Multi-dimensional Signal Processing and Deep Learning: Mathematical Approaches and Applications, Volume 1 (Smart Innovation, Systems and Technologies #234)
by Lakhmi C. Jain Roumen Kountchev Junsheng ShiThis book presents high-quality research in the field of 3D imaging technology. The second edition of International Conference on 3D Imaging Technology (3DDIT-MSP&DL) continues the good traditions already established by the first 3DIT conference (IC3DIT2019) to provide a wide scientific forum for researchers, academia and practitioners to exchange newest ideas and recent achievements in all aspects of image processing and analysis, together with their contemporary applications. The conference proceedings are published in 2 volumes. The main topics of the papers comprise famous trends as: 3D image representation, 3D image technology, 3D images and graphics, and computing and 3D information technology. In these proceedings, special attention is paid at the 3D tensor image representation, the 3D content generation technologies, big data analysis, and also deep learning, artificial intelligence, the 3D image analysis and video understanding, the 3D virtual and augmented reality, and many related areas. The first volume contains papers in 3D image processing, transforms and technologies. The second volume is about computing and information technologies, computer images and graphics and related applications. The two volumes of the book cover a wide area of the aspects of the contemporary multidimensional imaging and the related future trends from data acquisition to real-world applications based on various techniques and theoretical approaches.
3D Imaging Technologies—Multidimensional Signal Processing and Deep Learning: Methods, Algorithms and Applications, Volume 2 (Smart Innovation, Systems and Technologies #236)
by Lakhmi C. Jain Roumen Kountchev Yonghang TaiThis book presents high-quality research in the field of 3D imaging technology. The second edition of International Conference on 3D Imaging Technology (3DDIT-MSP&DL) continues the good traditions already established by the first 3DIT conference (IC3DIT2019) to provide a wide scientific forum for researchers, academia and practitioners to exchange newest ideas and recent achievements in all aspects of image processing and analysis, together with their contemporary applications. The conference proceedings are published in 2 volumes. The main topics of the papers comprise famous trends as: 3D image representation, 3D image technology, 3D images and graphics, and computing and 3D information technology. In these proceedings, special attention is paid at the 3D tensor image representation, the 3D content generation technologies, big data analysis, and also deep learning, artificial intelligence, the 3D image analysis and video understanding, the 3D virtual and augmented reality, and many related areas. The first volume contains papers in 3D image processing, transforms and technologies. The second volume is about computing and information technologies, computer images and graphics and related applications. The two volumes of the book cover a wide area of the aspects of the contemporary multidimensional imaging and the related future trends from data acquisition to real-world applications based on various techniques and theoretical approaches.
3D Imaging—Multidimensional Signal Processing and Deep Learning: 3D Images, Graphics and Information Technologies, Volume 1 (Smart Innovation, Systems and Technologies #297)
by Lakhmi C. Jain Roumen Kountchev Yonghang Tai Roumiana KountchevaThis book gathers selected papers presented at the conference “Advances in 3D Image and Graphics Representation, Analysis, Computing and Information Technology,” one of the first initiatives devoted to the problems of 3D imaging in all contemporary scientific and application areas. The two volumes of the book cover wide area of the aspects of the contemporary multidimensional imaging and outline the related future trends from data acquisition to real-world applications based on new techniques and theoretical approaches. This volume contains papers devoted to the theoretical representation and analysis of the 3D images. The related topics included are 3D image transformation, 3D tensor image representation, 3D content generation technologies, 3D graphic information processing, VR content generation technologies, multi-dimensional image processing, dynamic and auxiliary 3D displays, VR/AR/MR device, VR camera technologies, 3D imaging technologies and applications, 3D computer vision, 3D video communications, 3D medical images processing and analysis, 3D remote sensing images and systems, deep learning for image restoration and recognition, neural networks for MD image processing, etc.
3D Imaging—Multidimensional Signal Processing and Deep Learning: Multidimensional Signals, Images, Video Processing and Applications, Volume 2 (Smart Innovation, Systems and Technologies #298)
by Lakhmi C. Jain Roumen Kountchev Yonghang Tai Roumiana KountchevaThis book gathers selected papers presented at the conference “Advances in 3D Image and Graphics Representation, Analysis, Computing and Information Technology,” one of the first initiatives devoted to the problems of 3D imaging in all contemporary scientific and application areas. The two volumes of the book cover wide area of the aspects of the contemporary multidimensional imaging and outline the related future trends from data acquisition to real-world applications based on new techniques and theoretical approaches. This volume contains papers aimed at the multidimensional systems and signal processing, deep learning, mathematical approaches and the related applications. The related topics are multidimensional multi-component image processing; multidimensional image representation and super-resolution; compression of multidimensional spatio-temporal images; multidimensional image transmission systems; multidimensional signal processing; prediction and filtering of multidimensional process; intelligent multi-spectral and hyper-spectral image processing, intelligent multi-view image processing, 3D deep learning, 3D GIS and graphic database; data-based MD image retrieval and knowledge data mining; watermarking, hiding and encryption of MD images; intelligent visualization of MD images; forensic analysis systems for M3D graphics algorithm; 3D VR (Virtual Reality)/AR (Augmented Reality); applications of multidimensional signal processing; applications of multidimensional systems; multidimensional filters and filter-banks.
3D Imaging—Multidimensional Signal Processing and Deep Learning: Multidimensional Signals, Video Processing and Applications, Volume 2 (Smart Innovation, Systems and Technologies #348)
by Srikanta Patnaik Roumen Kountchev Yonghang Tai Roumiana KountchevaThis book presents high-quality research in the field of 3D imaging technology. The fourth edition of International Conference on 3D Imaging Technology (3DDIT-MSP&DL) continues the good traditions already established by the first three editions of the conference to provide a wide scientific forum for researchers, academia and practitioners to exchange newest ideas and recent achievements in all aspects of image processing and analysis, together with their contemporary applications. The conference proceedings are published in 2 volumes. The main topics of the papers comprise famous trends as: 3D image representation, 3D image technology, 3D images and graphics, and computing and 3D information technology. In these proceedings, special attention is paid at the 3D tensor image representation, the 3D content generation technologies, big data analysis, and also deep learning, artificial intelligence, the 3D image analysis and video understanding, the 3D virtual and augmented reality, and many related areas. The first volume contains papers in 3D image processing, transforms and technologies. The second volume is about computing and information technologies, computer images and graphics and related applications. The two volumes of the book cover a wide area of the aspects of the contemporary multidimensional imaging and the related future trends from data acquisition to real-world applications based on various techniques and theoretical approaches.
3D Imaging—Multidimensional Signal Processing and Deep Learning: Images, Augmented Reality and Information Technologies, Volume 1 (Smart Innovation, Systems and Technologies #349)
by Srikanta Patnaik Roumen Kountchev Yonghang Tai Roumiana KountchevaThis book presents high-quality research in the field of 3D imaging technology. The fourth edition of International Conference on 3D Imaging Technology (3DDIT-MSP&DL) continues the good traditions already established by the first three editions of the conference to provide a wide scientific forum for researchers, academia, and practitioners to exchange newest ideas and recent achievements in all aspects of image processing and analysis, together with their contemporary applications. The conference proceedings are published in two volumes. The main topics of the papers comprise famous trends as: 3D image representation, 3D image technology, 3D images and graphics, and computing and 3D information technology. In these proceedings, special attention is paid at the 3D tensor image representation, the 3D content generation technologies, big data analysis, and also deep learning, artificial intelligence, the 3D image analysis and video understanding, the 3D virtual and augmented reality, and many related areas. The first volume contains papers in 3D image processing, transforms, and technologies. The second volume is about computing and information technologies, computer images and graphics and related applications. The two volumes of the book cover a wide area of the aspects of the contemporary multidimensional imaging and the related future trends from data acquisition to real-world applications based on various techniques and theoretical approaches.
3D Immersive and Interactive Learning
by Yiyu Cai3D technology is not new; research on 3D started back in early 1960s. But unlike in previous times, 3D technology has now rapidly entered our daily life from cinema to office to home. Using 3D for education is a new yet challenging task. This book will present several innovative efforts using 3D for immersive and interactive learning covering a wide spectrum of education including gifted program, normal (technical) stream, and special needs education. The book will also share experience on curriculum-based 3D learning in classroom setting and co-curriculum-based 3D student research projects. The book is organized as follows. Chapter 1 introduces the fundamentals of 3D educational technology and their applications in immersive and interactive learning. Chapter 2 discusses the use of virtual reality in teaching and learning of Molecular Biology. Chapter 3 presents the daVinci Lab @ River Valley High School. Chapter 4 describes the 3D education development process. Chapter 5 studies the adaption 3D system for learning gains in lower secondary normal (technical) stream. Chapter 6 investigates the effects of virtual reality technology on spatial visualization skills. Chapter 7 showcases a sabbatical program for students to use 3D for Science, Technology, Engineering and Mathematics (STEM) learning. Chapter 8 shares the use of 3D virtual pink dolphin to assist special education. The foreword of this book is written by Dr Cheah Horn Mun, Director, Education Technology Division, Ministry of Education, Singapore.
3D Integration for NoC-based SoC Architectures (Integrated Circuits and Systems)
by Axel Jantsch Abbas Sheibanyrad Frédéric PétrotThis book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Nowadays the 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures are emerging as interesting, truly hot, broad topics. The present book gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. This book includes contributions from high level international teams working in this field.
3D Integration in VLSI Circuits: Implementation Technologies and Applications (Devices, Circuits, and Systems)
by Katsuyuki Sakuma and Krzysztof IniewskiCurrently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs. The goal of this book is to provide readers with an understanding of the latest challenges and issues in 3D integration. TSVs are not the only technology element needed for 3D integration. There are numerous other key enabling technologies required for 3D integration, and the speed of the development in this emerging field is very rapid. To provide readers with state-of-the-art information on 3D integration research and technology developments, each chapter has been contributed by some of the world’s leading scientists and experts from academia, research institutes, and industry from around the globe. Covers chip/wafer level 3D integration technology, memory stacking, reconfigurable 3D, and monolithic 3D IC. Discusses the use of silicon interposer and organic interposer. Presents architecture, design, and technology implementations for 3D FPGA integration. Describes oxide bonding, Cu/SiO2 hybrid bonding, adhesive bonding, and solder bonding. Addresses the issue of thermal dissipation in 3D integration.
3D Integration of Resistive Switching Memory (Frontiers in Semiconductor Technology)
by Qing LuoThis book offers a thorough exploration of the three-dimensional integration of resistive memory in all aspects, from the materials, devices, array-level issues, and integration structures to its applications. Resistive random-access memory (RRAM) is one of the most promising candidates for next-generation nonvolatile memory applications owing to its superior characteristics including simple structure, high switching speed, low power consumption, and compatibility with standard complementary metal oxide semiconductor (CMOS) process. To achieve large-scale, high-density integration of RRAM, the 3D cross array is undoubtedly the ideal choice. This book introduces the 3D integration technology of RRAM, and breaks it down into five parts: 1: Associative Problems in Crossbar array and 3D architectures;2: Selector Devices and Self-Selective Cells; 3: Integration of 3D RRAM; 4: Reliability Issues in 3D RRAM; 5: Applications of 3D RRAM beyond Storage.The book aspires to provide a relevant reference for students, researchers, engineers, and professionals working with resistive random-access memory or those interested in 3D integration technology in general.
3D Interconnect Architectures for Heterogeneous Technologies: Modeling and Optimization
by Lennart Bamberg Jan Moritz Joseph Alberto García-Ortiz Thilo PionteckThis book describes the first comprehensive approach to the optimization of interconnect architectures in 3D systems on chips (SoCs), specially addressing the challenges and opportunities arising from heterogeneous integration. Readers learn about the physical implications of using heterogeneous 3D technologies for SoC integration, while also learning to maximize the 3D-technology gains, through a physical-effect-aware architecture design. The book provides a deep theoretical background covering all abstraction-levels needed to research and architect tomorrow’s 3D-integrated circuits, an extensive set of optimization methods (for power, performance, area, and yield), as well as an open-source optimization and simulation framework for fast exploration of novel designs.
3D Kinematics
by Thomas HaslwanterThis book presents an introduction to the analysis of general movements in 3D space, especially for movements of the human body. It is based on the lecture notes of a class on 3D Kinematics, which the author has been holding in the Master Degree Program of his home institution, the University of Applied Sciences Upper Austria. The lecture introduces the mathematics underlying the measurement and analysis of 3D movements. The target audience primarily comprises research experts in the field, but the book may also be beneficial for graduate students alike.
3D Microelectronic Packaging: From Fundamentals to Applications (Springer Series in Advanced Microelectronics #57)
by Yan Li Deepak GoyalThis volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future research and development.
3D Microelectronic Packaging: From Architectures to Applications (Springer Series in Advanced Microelectronics #64)
by Yan Li Deepak GoyalThis book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. It provides readers an in-depth understanding of the latest research and development findings regarding this key industry trend, including TSV, die processing, micro-bumps for LMI and MMI, direct bonding and advanced materials, as well as quality, reliability, fault isolation, and failure analysis for 3D microelectronic packages. Images, tables, and didactic schematics are used to illustrate and elaborate on the concepts discussed. Readers will gain a general grasp of 3D packaging, quality and reliability concerns, and common causes of failure, and will be introduced to developing areas and remaining gaps in 3D packaging that can help inspire future research and development.