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3D Graphics for Game Programming
by JungHyun HanDesigned for advanced undergraduate and beginning graduate courses, 3D Graphics for Game Programming presents must-know information for success in interactive graphics. Assuming a minimal prerequisite understanding of vectors and matrices, it also provides sufficient mathematical background for game developers to combine their previous experie
3D IC and RF SiPs: Advanced Stacking And Planar Solutions For 5g Mobility (Wiley - IEEE)
by Lih-Tyng Hwang Tzyy-Sheng Jason HorngAn interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessments Features an interdisciplinary approach to the enabling technologies and hardware for 3D ICs and 5G mobility Presents statistical treatments and examples with tools that are easily accessible, such as Microsoft’s Excel and Minitab Fundamental design topics such as electromagnetic design for logic and RF/passives centric circuits are explained in detail Provides chapter-wise review questions and powerpoint slides as teaching tools
3D Image Technologies, Robotics and Control Engineering: Proceedings of WCI3DT 2024 (Smart Innovation, Systems and Technologies #419)
by Lakhmi C. Jain Srikanta Patnaik Wenfeng Wang Roumiana KountchevaThis book features a collection of high-quality, peer-reviewed research papers presented at Third 'World Conference on Intelligent and 3D Technologies' (WCI3DT 2024), held in China during May 24–26, 2024. The book provides an opportunity to researchers and academia as well as practitioners from industry to publish their ideas and recent research development work on all aspects of 3D imaging technologies and artificial intelligence, their applications and other related areas. The book presents ideas and the works of scientists, engineers, educators and students from all over the world from institutions and industries.
3D Imaging Technologies—Multi-dimensional Signal Processing and Deep Learning: Mathematical Approaches and Applications, Volume 1 (Smart Innovation, Systems and Technologies #234)
by Lakhmi C. Jain Roumen Kountchev Junsheng ShiThis book presents high-quality research in the field of 3D imaging technology. The second edition of International Conference on 3D Imaging Technology (3DDIT-MSP&DL) continues the good traditions already established by the first 3DIT conference (IC3DIT2019) to provide a wide scientific forum for researchers, academia and practitioners to exchange newest ideas and recent achievements in all aspects of image processing and analysis, together with their contemporary applications. The conference proceedings are published in 2 volumes. The main topics of the papers comprise famous trends as: 3D image representation, 3D image technology, 3D images and graphics, and computing and 3D information technology. In these proceedings, special attention is paid at the 3D tensor image representation, the 3D content generation technologies, big data analysis, and also deep learning, artificial intelligence, the 3D image analysis and video understanding, the 3D virtual and augmented reality, and many related areas. The first volume contains papers in 3D image processing, transforms and technologies. The second volume is about computing and information technologies, computer images and graphics and related applications. The two volumes of the book cover a wide area of the aspects of the contemporary multidimensional imaging and the related future trends from data acquisition to real-world applications based on various techniques and theoretical approaches.
3D Imaging Technologies—Multidimensional Signal Processing and Deep Learning: Methods, Algorithms and Applications, Volume 2 (Smart Innovation, Systems and Technologies #236)
by Lakhmi C. Jain Roumen Kountchev Yonghang TaiThis book presents high-quality research in the field of 3D imaging technology. The second edition of International Conference on 3D Imaging Technology (3DDIT-MSP&DL) continues the good traditions already established by the first 3DIT conference (IC3DIT2019) to provide a wide scientific forum for researchers, academia and practitioners to exchange newest ideas and recent achievements in all aspects of image processing and analysis, together with their contemporary applications. The conference proceedings are published in 2 volumes. The main topics of the papers comprise famous trends as: 3D image representation, 3D image technology, 3D images and graphics, and computing and 3D information technology. In these proceedings, special attention is paid at the 3D tensor image representation, the 3D content generation technologies, big data analysis, and also deep learning, artificial intelligence, the 3D image analysis and video understanding, the 3D virtual and augmented reality, and many related areas. The first volume contains papers in 3D image processing, transforms and technologies. The second volume is about computing and information technologies, computer images and graphics and related applications. The two volumes of the book cover a wide area of the aspects of the contemporary multidimensional imaging and the related future trends from data acquisition to real-world applications based on various techniques and theoretical approaches.
3D Imaging of the Environment: Mapping and Monitoring
by John MeneelyThis is a comprehensive, overarching, interdisciplinary book and a valuable contribution to a unified view of visualisation, imaging, and mapping. It covers a variety of modern techniques, across an array of spatial scales, with examples of how to map, monitor, and visualise the world in which we live. The authors give detailed explanations of the techniques used to map and monitor the built and natural environment and how that data, collected from a wide range of scales and cost options, is translated into an image or visual experience. It is written in a way that successfully reaches technical, professional, and academic readers alike, particularly geographers, architects, geologists, and planners. FEATURES Includes in-depth discussion on 3D image processing and modeling Focuses on the 3D application of remote sensing, including LiDAR and digital photography acquired by UAS and terrestrial techniques Introduces a broad range of data collection techniques and visualisation methods Includes contributions from outstanding experts and interdisciplinary teams involved in earth sciences Presents an open access chapter about the EU-funded CHERISH Project, detailing the development of a toolkit for the 3D documentation and analysis of the combined coastline shared between Ireland and Wales Intended for those with a background in the technology involved with imaging and mapping, the contributions shared in this book introduce readers to new and emerging 3D imaging tools and programs.
3D Imaging—Multidimensional Signal Processing and Deep Learning: 3D Images, Graphics and Information Technologies, Volume 1 (Smart Innovation, Systems and Technologies #297)
by Lakhmi C. Jain Roumen Kountchev Yonghang Tai Roumiana KountchevaThis book gathers selected papers presented at the conference “Advances in 3D Image and Graphics Representation, Analysis, Computing and Information Technology,” one of the first initiatives devoted to the problems of 3D imaging in all contemporary scientific and application areas. The two volumes of the book cover wide area of the aspects of the contemporary multidimensional imaging and outline the related future trends from data acquisition to real-world applications based on new techniques and theoretical approaches. This volume contains papers devoted to the theoretical representation and analysis of the 3D images. The related topics included are 3D image transformation, 3D tensor image representation, 3D content generation technologies, 3D graphic information processing, VR content generation technologies, multi-dimensional image processing, dynamic and auxiliary 3D displays, VR/AR/MR device, VR camera technologies, 3D imaging technologies and applications, 3D computer vision, 3D video communications, 3D medical images processing and analysis, 3D remote sensing images and systems, deep learning for image restoration and recognition, neural networks for MD image processing, etc.
3D Imaging—Multidimensional Signal Processing and Deep Learning: Images, Augmented Reality and Information Technologies, Volume 1 (Smart Innovation, Systems and Technologies #349)
by Srikanta Patnaik Roumen Kountchev Yonghang Tai Roumiana KountchevaThis book presents high-quality research in the field of 3D imaging technology. The fourth edition of International Conference on 3D Imaging Technology (3DDIT-MSP&DL) continues the good traditions already established by the first three editions of the conference to provide a wide scientific forum for researchers, academia, and practitioners to exchange newest ideas and recent achievements in all aspects of image processing and analysis, together with their contemporary applications. The conference proceedings are published in two volumes. The main topics of the papers comprise famous trends as: 3D image representation, 3D image technology, 3D images and graphics, and computing and 3D information technology. In these proceedings, special attention is paid at the 3D tensor image representation, the 3D content generation technologies, big data analysis, and also deep learning, artificial intelligence, the 3D image analysis and video understanding, the 3D virtual and augmented reality, and many related areas. The first volume contains papers in 3D image processing, transforms, and technologies. The second volume is about computing and information technologies, computer images and graphics and related applications. The two volumes of the book cover a wide area of the aspects of the contemporary multidimensional imaging and the related future trends from data acquisition to real-world applications based on various techniques and theoretical approaches.
3D Imaging—Multidimensional Signal Processing and Deep Learning: Multidimensional Signals, Images, Video Processing and Applications, Volume 2 (Smart Innovation, Systems and Technologies #298)
by Lakhmi C. Jain Roumen Kountchev Yonghang Tai Roumiana KountchevaThis book gathers selected papers presented at the conference “Advances in 3D Image and Graphics Representation, Analysis, Computing and Information Technology,” one of the first initiatives devoted to the problems of 3D imaging in all contemporary scientific and application areas. The two volumes of the book cover wide area of the aspects of the contemporary multidimensional imaging and outline the related future trends from data acquisition to real-world applications based on new techniques and theoretical approaches. This volume contains papers aimed at the multidimensional systems and signal processing, deep learning, mathematical approaches and the related applications. The related topics are multidimensional multi-component image processing; multidimensional image representation and super-resolution; compression of multidimensional spatio-temporal images; multidimensional image transmission systems; multidimensional signal processing; prediction and filtering of multidimensional process; intelligent multi-spectral and hyper-spectral image processing, intelligent multi-view image processing, 3D deep learning, 3D GIS and graphic database; data-based MD image retrieval and knowledge data mining; watermarking, hiding and encryption of MD images; intelligent visualization of MD images; forensic analysis systems for M3D graphics algorithm; 3D VR (Virtual Reality)/AR (Augmented Reality); applications of multidimensional signal processing; applications of multidimensional systems; multidimensional filters and filter-banks.
3D Imaging—Multidimensional Signal Processing and Deep Learning: Multidimensional Signals, Video Processing and Applications, Volume 2 (Smart Innovation, Systems and Technologies #348)
by Srikanta Patnaik Roumen Kountchev Yonghang Tai Roumiana KountchevaThis book presents high-quality research in the field of 3D imaging technology. The fourth edition of International Conference on 3D Imaging Technology (3DDIT-MSP&DL) continues the good traditions already established by the first three editions of the conference to provide a wide scientific forum for researchers, academia and practitioners to exchange newest ideas and recent achievements in all aspects of image processing and analysis, together with their contemporary applications. The conference proceedings are published in 2 volumes. The main topics of the papers comprise famous trends as: 3D image representation, 3D image technology, 3D images and graphics, and computing and 3D information technology. In these proceedings, special attention is paid at the 3D tensor image representation, the 3D content generation technologies, big data analysis, and also deep learning, artificial intelligence, the 3D image analysis and video understanding, the 3D virtual and augmented reality, and many related areas. The first volume contains papers in 3D image processing, transforms and technologies. The second volume is about computing and information technologies, computer images and graphics and related applications. The two volumes of the book cover a wide area of the aspects of the contemporary multidimensional imaging and the related future trends from data acquisition to real-world applications based on various techniques and theoretical approaches.
3D Immersive and Interactive Learning
by Yiyu Cai3D technology is not new; research on 3D started back in early 1960s. But unlike in previous times, 3D technology has now rapidly entered our daily life from cinema to office to home. Using 3D for education is a new yet challenging task. This book will present several innovative efforts using 3D for immersive and interactive learning covering a wide spectrum of education including gifted program, normal (technical) stream, and special needs education. The book will also share experience on curriculum-based 3D learning in classroom setting and co-curriculum-based 3D student research projects. The book is organized as follows. Chapter 1 introduces the fundamentals of 3D educational technology and their applications in immersive and interactive learning. Chapter 2 discusses the use of virtual reality in teaching and learning of Molecular Biology. Chapter 3 presents the daVinci Lab @ River Valley High School. Chapter 4 describes the 3D education development process. Chapter 5 studies the adaption 3D system for learning gains in lower secondary normal (technical) stream. Chapter 6 investigates the effects of virtual reality technology on spatial visualization skills. Chapter 7 showcases a sabbatical program for students to use 3D for Science, Technology, Engineering and Mathematics (STEM) learning. Chapter 8 shares the use of 3D virtual pink dolphin to assist special education. The foreword of this book is written by Dr Cheah Horn Mun, Director, Education Technology Division, Ministry of Education, Singapore.
3D Integration for NoC-based SoC Architectures (Integrated Circuits and Systems)
by Axel Jantsch Abbas Sheibanyrad Frédéric PétrotThis book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Nowadays the 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures are emerging as interesting, truly hot, broad topics. The present book gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. This book includes contributions from high level international teams working in this field.
3D Integration in VLSI Circuits: Implementation Technologies and Applications (Devices, Circuits, and Systems)
by Katsuyuki Sakuma and Krzysztof IniewskiCurrently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs. The goal of this book is to provide readers with an understanding of the latest challenges and issues in 3D integration. TSVs are not the only technology element needed for 3D integration. There are numerous other key enabling technologies required for 3D integration, and the speed of the development in this emerging field is very rapid. To provide readers with state-of-the-art information on 3D integration research and technology developments, each chapter has been contributed by some of the world’s leading scientists and experts from academia, research institutes, and industry from around the globe. Covers chip/wafer level 3D integration technology, memory stacking, reconfigurable 3D, and monolithic 3D IC. Discusses the use of silicon interposer and organic interposer. Presents architecture, design, and technology implementations for 3D FPGA integration. Describes oxide bonding, Cu/SiO2 hybrid bonding, adhesive bonding, and solder bonding. Addresses the issue of thermal dissipation in 3D integration.
3D Integration of Resistive Switching Memory (Frontiers in Semiconductor Technology)
by Qing LuoThis book offers a thorough exploration of the three-dimensional integration of resistive memory in all aspects, from the materials, devices, array-level issues, and integration structures to its applications. Resistive random-access memory (RRAM) is one of the most promising candidates for next-generation nonvolatile memory applications owing to its superior characteristics including simple structure, high switching speed, low power consumption, and compatibility with standard complementary metal oxide semiconductor (CMOS) process. To achieve large-scale, high-density integration of RRAM, the 3D cross array is undoubtedly the ideal choice. This book introduces the 3D integration technology of RRAM, and breaks it down into five parts: 1: Associative Problems in Crossbar array and 3D architectures;2: Selector Devices and Self-Selective Cells; 3: Integration of 3D RRAM; 4: Reliability Issues in 3D RRAM; 5: Applications of 3D RRAM beyond Storage.The book aspires to provide a relevant reference for students, researchers, engineers, and professionals working with resistive random-access memory or those interested in 3D integration technology in general.
3D Interconnect Architectures for Heterogeneous Technologies: Modeling and Optimization
by Thilo Pionteck Lennart Bamberg Jan Moritz Joseph Alberto García-OrtizThis book describes the first comprehensive approach to the optimization of interconnect architectures in 3D systems on chips (SoCs), specially addressing the challenges and opportunities arising from heterogeneous integration. Readers learn about the physical implications of using heterogeneous 3D technologies for SoC integration, while also learning to maximize the 3D-technology gains, through a physical-effect-aware architecture design. The book provides a deep theoretical background covering all abstraction-levels needed to research and architect tomorrow’s 3D-integrated circuits, an extensive set of optimization methods (for power, performance, area, and yield), as well as an open-source optimization and simulation framework for fast exploration of novel designs.
3D Kinematics
by Thomas HaslwanterThis book presents an introduction to the analysis of general movements in 3D space, especially for movements of the human body. It is based on the lecture notes of a class on 3D Kinematics, which the author has been holding in the Master Degree Program of his home institution, the University of Applied Sciences Upper Austria. The lecture introduces the mathematics underlying the measurement and analysis of 3D movements. The target audience primarily comprises research experts in the field, but the book may also be beneficial for graduate students alike.
3D Microelectronic Packaging: From Architectures to Applications (Springer Series in Advanced Microelectronics #64)
by Yan Li Deepak GoyalThis book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. It provides readers an in-depth understanding of the latest research and development findings regarding this key industry trend, including TSV, die processing, micro-bumps for LMI and MMI, direct bonding and advanced materials, as well as quality, reliability, fault isolation, and failure analysis for 3D microelectronic packages. Images, tables, and didactic schematics are used to illustrate and elaborate on the concepts discussed. Readers will gain a general grasp of 3D packaging, quality and reliability concerns, and common causes of failure, and will be introduced to developing areas and remaining gaps in 3D packaging that can help inspire future research and development.
3D Microelectronic Packaging: From Fundamentals to Applications (Springer Series in Advanced Microelectronics #57)
by Yan Li Deepak GoyalThis volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future research and development.
3D Modeling of Buildings: Outstanding Sites
by Raphaële Héno Laure ChandelierConventional topographic databases, obtained by capture on aerial or spatial images provide a simplified 3D modeling of our urban environment, answering the needs of numerous applications (development, risk prevention, mobility management, etc.). However, when we have to represent and analyze more complex sites (monuments, civil engineering works, archeological sites, etc.), these models no longer suffice and other acquisition and processing means have to be implemented. This book focuses on the study of adapted lifting means for “notable buildings”. The methods tackled in this book cover lasergrammetry and the current techniques of dense correlation based on images using conventional photogrammetry.
3D Modeling of Nonlinear Wave Phenomena on Shallow Water Surfaces
by I. B. AbbasovWith climate change, erosion, and human encroachment on coastal environments growing all over the world, it is increasingly important to protect populations and environments close to the sea from storms, tsunamis, and other events that can be not just costly to property but deadly. This book is one step in bringing the science of protection from these events forward, the most in-depth study of its kind ever published. The analytic and numerical modeling problems of nonlinear wave activities in shallow water are analyzed in this work. Using the author’s unique method described herein, the equations of shallow water are solved, and asymmetries that cannot be described by the Stokes theory are solved. Based on analytical expressions, the impacts of dispersion effects to wave profiles transformation are taken into account. The 3D models of the distribution and refraction of nonlinear surface gravity wave at the various coast formations are introduced, as well. The work covers the problems of numerical simulation of the run-up of nonlinear surface gravity waves in shallow water, transformation of the surface waves for the 1D case, and models for the refraction of numerical modeling of the run-up of nonlinear surface gravity waves at beach approach of various slopes. 2D and 3D modeling of nonlinear surface gravity waves are based on Navier-Stokes equations. In 2D modeling the influence of the bottom of the coastal zone on flooding of the coastal zone during storm surges was investigated. Various stages of the run-up of nonlinear surface gravity waves are introduced and analyzed. The 3D modeling process of the run-up is tested for the coast protection work of the slope type construction. Useful for students and veteran engineers and scientists alike, this is the only book covering these important issues facing anyone working with coastal models and ocean, coastal, and civil engineering in this area.
3D Motion of Rigid Bodies: A Foundation for Robot Dynamics Analysis (Studies in Systems, Decision and Control #191)
by Ernesto Olguín DíazThis book offers an excellent complementary text for an advanced course on the modelling and dynamic analysis of multi-body mechanical systems, and provides readers an in-depth understanding of the modelling and control of robots. While the Lagrangian formulation is well suited to multi-body systems, its physical meaning becomes paradoxically complicated for single rigid bodies. Yet the most advanced numerical methods rely on the physics of these single rigid bodies, whose dynamic is then given among multiple formulations by the set of the Newton–Euler equations in any of their multiple expression forms. This book presents a range of simple tools to express in succinct form the dynamic equation for the motion of a single rigid body, either free motion (6-dimension), such as that of any free space navigation robot or constrained motion (less than 6-dimension), such as that of ground or surface vehicles. In the process, the book also explains the equivalences of (and differences between) the different formulations.
3D Multiscale Physiological Human
by Nadia Magnenat-Thalmann Osman Ratib Hon Fai Choi3D Multiscale Physiological Human aims to promote scientific exchange by bringing together overviews and examples of recent scientific and technological advancements across a wide range of research disciplines. As a result, the variety in methodologies and knowledge paradigms are contrasted, revealing potential gaps and opportunities for integration. Chapters have been contributed by selected authors in the relevant domains of tissue engineering, medical image acquisition and processing, visualization, modeling, computer aided diagnosis and knowledge management. The multi-scale and multi-disciplinary research aspects of articulations in humans are highlighted, with a particular emphasis on medical diagnosis and treatment of musculoskeletal diseases and related disorders. The need for multi-scale modalities and multi-disciplinary research is an emerging paradigm in the search for a better biological and medical understanding of the human musculoskeletal system. This is particularly motivated by the increasing socio-economic burden of disability and musculoskeletal diseases, especially in the increasing population of elderly people. Human movement is generated through a complex web of interactions between embedded physiological systems on different spatiotemporal scales, ranging from the molecular to the organ level. Much research is dedicated to the understanding of each of these systems, using methods and modalities tailored for each scale. Nevertheless, combining knowledge from different perspectives opens new venues of scientific thinking and stimulates innovation. Integration of this mosaic of multifaceted data across multiple scales and modalities requires further exploration of methods in simulations and visualization to obtain a comprehensive synthesis. However, this integrative approach cannot be achieved without a broad appreciation for the multiple research disciplines involved.
3D Nanoelectronic Computer Architecture and Implementation (Series in Material Science and Engineering)
by David Crawley K. Nikolic M. ForshawIt is becoming increasingly clear that the two-dimensional layout of devices on computer chips hinders the development of high-performance computer systems. Three-dimensional structures will be needed to provide the performance required to implement computationally intensive tasks. 3-D Nanoelectronic Computer Architecture and Implementation reviews the state of the art in nanoelectronic device design and fabrication and discusses the architectural aspects of 3-D designs, including the possible use of molecular wiring and carbon nanotube interconnections. This is a valuable reference for those involved in the design and development of nanoelectronic devices and technology.
3D Printed Conducting Polymers: Fundamentals, Advances, and Challenges (Smart 3D/4D Printing)
by Ram K. GuptaConducting polymers are smart materials that possess unique and tuneable electrical, optical, and electrochemical properties. 3D printing technology is rapidly advancing, and using conducting polymers for this process can lead to many emerging applications as it can print complex structures cost effectively, though many challenges need to be overcome before this technology can be used on a large scale. 3D Printed Conducting Polymers highlights the state of the art of these materials, the basics of additive printing, and the role of conducting polymers in additive manufacturing. It also discusses applications in energy, sensors, and biomedical areas. Covers fundamentals, synthesis, and various applications of conducting polymers. Discusses basics of energy devices, sensors, and materials technology for emerging applications. Explores new approaches for the synthesis of conducting polymers and composites for 3D print technology. Details future applications and challenges. Offering direction to researchers and advanced students to better understand the chemistry and electrochemical properties of conducting polymers and technologies for 3D printing, this book advances the science and technology of this emerging field for readers in materials and chemical engineering, biotechnology, energy, and related disciplines.
3D Printed Science Projects Volume 2: Physics, Math, Engineering and Geology Models
by Joan Horvath Rich CameronLearn physics, engineering, and geology concepts usually seen in high school and college in an easy, accessible style. This second volume addresses these topics for advanced science fair participants or those who just like reading about and understanding science. 3D Printed Science Project Volume 2 describes eight open-source 3D printable models, as well as creative activities using the resulting 3D printed pieces. The files are designed to print as easily as possible, and the authors give tips for printing them on open source printers. As 3D printers become more and more common and affordable, hobbyists, teachers, parents, and students stall out once they've printed some toys and a few household items. To get beyond this, most people benefit from a "starter set" of objects as a beginning point in their explorations, partially just to see what is possible. This book tells you the solid science stories that these models offer, and provides them in open-source repositories. What You Will Learn: Create (and present the science behind) 3D printed models Review innovative ideas for tactile ways to learn concepts in engineering, geology and physics Learn what makes a models easy or hard to 3D print Who This Book Is For: The technology- squeamish teacher and parents who want their kids to learn something from their 3D printer but don't know how, as well as high schoolers and undergraduates.